Items where Author is "Lee, Tzong-Ming"
Lee Sanchez, William Anderson and Huang, Chen-Yang and Chen, Jian-Xun and Soong, Yu-Chian and Chan, Ying-Nan and Chiou, Kuo-Chan and Lee, Tzong-Ming and Cheng, Chih-Chia and Chiu, Chih-Wei (2021) Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers, 13 (1). p. 147. ISSN 2073-4360
Lee Sanchez, William Anderson and Huang, Chen-Yang and Chen, Jian-Xun and Soong, Yu-Chian and Chan, Ying-Nan and Chiou, Kuo-Chan and Lee, Tzong-Ming and Cheng, Chih-Chia and Chiu, Chih-Wei (2021) Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers, 13 (1). p. 147. ISSN 2073-4360