Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

Lee Sanchez, William Anderson and Huang, Chen-Yang and Chen, Jian-Xun and Soong, Yu-Chian and Chan, Ying-Nan and Chiou, Kuo-Chan and Lee, Tzong-Ming and Cheng, Chih-Chia and Chiu, Chih-Wei (2021) Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers, 13 (1). p. 147. ISSN 2073-4360

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Abstract

In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

Item Type: Article
Uncontrolled Keywords: underfill encapsulation; aluminum oxide; boron nitride; hybrid filler; thermal conductivity; coefficient of thermal expansion
Subjects: STM Repository > Chemical Science
Depositing User: Managing Editor
Date Deposited: 03 Oct 2024 04:43
Last Modified: 03 Oct 2024 04:43
URI: http://classical.goforpromo.com/id/eprint/768

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